Sale!

Maui Moisture Strength & Repair Hair Mask for Breakage Prevention

Original price was: $8.99.Current price is: $5.99.

In stock

Quantity
SKU: 022796180346 Category: Brand:

Description

Maui Moisture Strength & Anti-Breakage Hair Mask

This creamy hair mask is infused with rich agave, hibiscus and pineapple extract.

  • It’s gentle enough for the most fragile strands while helping to increase elasticity and helps strands resist breakage.
  • Your hair is left tangle free with a healthy shine.

Directions: As a deep treatment (In Shower) After shampooing, apply a small amount into palm and evenly distribute into damp hair from root to ends. For optimum results, allow the steam from the shower to penetrate each strand. Leave in for 5 minutes then rinse. After the shower: To use as a leave-in treatment, apply a small amount to damp hair. Then, comb or use fingers to detangle. Style as usual. Warning: Avoid contact with eyes. If contact occurs rinse immediately. For best results use in conjunction with other Maui Moisture products. As good as I look and smell, please do not eat me!

Ingredients: Aloe Barbadensis Leaf Vera, Water (Aqua), Glycerin, Cocos Nucifera (Coconut) Oil, Isopropyl Myristate, Cetearyl Alcohol, Glyceryl Stearate, Cetyl Alcohol, PEG-40 Hydrogenated Castor Oil, Cocos Nucifera (Coconut) Water, Saccharomyces/Agave Americana Leaf Ferment Filtrate, Hibiscus Sabdariffa Seed Oil, Ananas Sativus (Pineapple) Fruit Extract, Butyrospermum Parkii (Shea) Butter, Microcrystalline Wax (Cera Microcristallina), Hydrogenated Soybean Oil, Polyquaternium-37, Capryloyl Glycerin/Sebacic Acid Copolymer, Diheptyl Succinate, Propylene Glycol Dicaprylate/Dicaprate, PPG-1 Trideceth-6, Stearic Acid, Ceteareth-20, Propylene Glycol, Tapioca Starch, DMDM Hydantoin, Diazolidinyl Urea, Iodopropynyl Butylcarbamate, Fragrance (Parfum).

Explore more from our collection.

Reviews

There are no reviews yet.

Be the first to review “Maui Moisture Strength & Repair Hair Mask for Breakage Prevention”

Your email address will not be published. Required fields are marked *